I will design 77ghz mmwave radar pcb, patch antenna, bga launch and rogers stackup
pcb design and firmware development
Sobre este Serviço
Hello and Welcome!
At 77GHz, PCB layout is part of the RF circuit itself. Trace geometry, dielectric thickness, copper roughness, impedance control, via transitions, BGA launches, antenna coupling, and material selection can directly affect insertion loss, phase, radiation efficiency, and radar performance.
I will design a high-frequency 77GHz mmWave radar PCB engineered around RF signal integrity, antenna performance, and manufacturability.
What I Will Provide:
- 77GHz mmWave radar PCB design
- Rogers RF stackup development
- 77GHz patch antenna design
- BGA RF launch and transition design
- Controlled-impedance RF routing
- Microstrip and grounded CPW structures
- RF via transitions and stitching
- Antenna feed and matching structures
- High-frequency component placement
- Manufacturing-ready PCB files
Why Choose Me:
- RF-focused PCB design approach
- 77GHz-aware transmission-line geometry
- Rogers material and stackup knowledge
- Precision BGA launch design
- Antenna-aware PCB layout
- Controlled-impedance routing
- Manufacturability considered from the start
Ready to Build Your 77GHz RF Hardware? Message now and let get started!!!
Outros serviços de Engenharia Eletrônica que eu ofereço
Perguntas frequentes
Can you design a complete 77GHz mmWave radar PCB?
Yes. I can handle the RF PCB layout, Rogers stackup, BGA launch, antenna feed, grounding, and manufacturing outputs.
Can you design the 77GHz patch antenna?
Yes. I can design and integrate patch antennas with appropriate feed structures and PCB constraints.
Do you work with Rogers materials?
Yes. I can develop RF stackups around suitable Rogers laminates based on frequency, fabrication, and performance requirements.
Can you design BGA-to-RF launches?
Yes. I can design and optimize BGA launches, via transitions, impedance-controlled traces, and RF fanout structures.
Can you handle controlled impedance at 77GHz?
Yes. Trace geometry, dielectric thickness, copper, layer configuration, and fabrication tolerances are considered.

