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Wendi K
@packagingeng_id
Level 1
Industrial Packaging Structural Engineer, ArtiosCAD Dieline Specialist
Indonésia
Inglês, Indonésio
Sobre mim
Structural Packaging Engineer with 12+ years at two global leaders: Asia
Pulp & Paper (APP) and Tri-Wall (Japan).
I create precise, manufacturing-ready dielines using ArtiosCAD. Whether
standard RSC boxes, complex mailers, or heavy-duty industrial packaging,
I engineer solutions ready for immediate production.
Deep expertise: Material properties (E-flute, B-flute, Triple Wall),
structural integrity, cost optimization, and international compliance
(FEFCO/ECMA).
Your packaging isn't just design—it's engineered for factory success. Fast turnaround.
Message me your specifications.
Habilidades
Wendi K
offline •
Tempo médio de resposta: 5 horas
Conheça meus serviços
Design dieline
I will create professional artioscad dielines and 3d packaging
4 Avaliações
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kimscopelliti
Estados Unidos
Wendi really understood what I was looking for in packaging and went the extra mile to deliver a very professional design that met my goals. I look forward to working with him again in the near future. Thank you, Wendi!
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shivismagee
Reino Unido
Resposta do freelancer
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mofado77
Cliente recorrente
Canadá
Útil?
anasumardi
Indonésia
Perfect dieline for products with minimal height. Efficient and cost-effective.
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