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callumxvance

CALLUM VANCE

@callumxvance

Electronics and Embedded Hardware Design Engineer

Reino Unido
Inglês, Alemão, Francês, Espanhol, Italiano, Holandês, Grego
Algumas informações são exibidas no idioma inglês.
Sobre mim
Electronics Engineer with 7 years of hardware design experience. I specialize in turning complex schematics into reliable, factory-ready boards optimized for manufacturing. Core skills: • Multilayer PCB layout • Signal integrity • DFM rules • BLE design • RF telematics • Embedded hardware. I work daily with STM32, ARM Cortex, Nordic nRF52, Raspberry Pi architectures using Altium, KiCad to deliver optimized wireless, industrial, high-speed computing solutions. Let’s connect to discuss your exact specifications before launching your order.... Saiba mais

Habilidades

c
callumxvance
CALLUM VANCE
offline • 

Conheça meus serviços

Circuito Impresso (PCB)
I will design nordic nrf52 ble wearable, smart sensor pcb, iot designs in cadence
A partir deUS$ 10 /projetoMais detalhes

Experiência profissional

LinkedIn

Electronics Design Engineer

LinkedIn • Autônomo

Mar 2019 - Present • 7 yrs 5 mos

Lead electronics design engineer specializing in high-density, multi-layer PCB layout and embedded hardware architectures. Responsible for the end-to-end development of industrial IoT modules, commercial wearable devices, and high-speed processing carrier boards. Key Achievements & Technical Scope: - Designed and routed 20+ production-ready wireless PCB architectures utilizing Nordic nRF52 BLE, LoRa, and GSM/GPS telematics systems. - Engineered complex microcontroller circuits using STM32 and ARM Cortex microprocessors, optimizing layouts for ultra-low power consumption. - Developed custom custom Linux-capable carrier boards for Raspberry Pi Compute Modules (CM4), managing high-speed signal tracks. - Enforced strict Design for Manufacturing (DFM) and Design for Assembly (DFA) rules, reducing hardware revision cycles by 40%. - Performed advanced signal integrity (SI) simulations, impedance matching, and EMI/EMC mitigation on high-frequency differential pairs.