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Development Engineer Intern
Bosch Global • Meio período
Aug 2021 - Sep 2022 • 1 yr 1 mo
Led the scouting and evaluation of next-generation solder compositions, ensuring high-reliability performance for automotive electronic sensors under JEDEC standards. Developed high-selectivity cleaning processes using APPJ technology to resolve One-Time Programmable (OTP) chip issues without compromising program integrity.